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加大层合机

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该机主要用于智能卡、RFID及普通卡的层合工艺,冷热双塔层合;双液压泵加压,四压力缸变压力层合,PLC控制,压力精度高。可根据客户需求制造特定层压板尺寸的层合机。

l Plus Lamination Machine

This machine is mainly used for lamination of IC cards, ID cards and ordinary cards. It has both hot and cold towers, the dual hydraulic pump for pressuring and four cylinder for variable pressure. The lamination is segmented and controlled by PLC which leads to the high grade pressure. The lamination area can be customized.


产品概述和特点 技术参数 相关下载

加大层合机

该机主要用于智能卡、RFID及普通卡的层合工艺,冷热双塔层合;双液压泵加压,四压力缸变压力层合,PLC控制,压力精度高。可根据客户需求制造特定层压板尺寸的层合机。

可增加减重力装置

可增加电动上料车

l Plus Lamination Machine

This machine is mainly used for lamination of IC cards, ID cards and ordinary cards. It has both hot and cold towers, the dual hydraulic pump for pressuring and four cylinder for variable pressure. The lamination is segmented and controlled by PLC which leads to the high grade pressure. The lamination area can be customized.

l Optional gravity reduction device.

l Optional material loader


技术参数

额定压力:18Mpa

压力精度:1 Bar

温度精度:±1℃

电源电压:三相AC380V   50Hz  

总 功 率: 38kw

层压塔数:2 塔 (热压工位:5,冷压工位:5)

控制方式:PLC

层压面积:520mm×700mm

重    量:3500kg

外型尺寸:2800mm(L)×800(W)×1800mm(H)

l Echnical parameter

  Rated Pressure18Mpa

  Pressure precision1Bar

  Temperature precision1

  Power Voltage3 Phase AC380V 50Hz

  Consumption38kw

  Opening: Cold/Hot in 5 tower each

  Contact way:PLC

  Laminating Area: 520mm*700mm

Weight3500kg

Dimension2800mm(L)×800(W)×1800mm(H)