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CH25-35B层合机

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CH25-35B层合机

该机主要用于智能卡及普通卡的层合工艺。该设备体积小、重量轻,适用于小型卡厂的生产及大、中型卡厂的前期层合试验。

CH25-35B Lamination Machine

l This is for laminating of smart cards and ordinary cards. It is a small and light-weight machine which is suitable for the production of small card factories and the pre-laminated test of the medium-sized and the large card factories.




产品概述和特点 技术参数 相关下载


设备介绍:

●该机主要用于IC卡、ID卡及普通卡的层合工艺。

●该设备体积小、重量轻,适用于小型卡厂的生产及大、中型卡厂的前期层合试验。

CH25-35B Lamination Machine

l This is for laminating of smart cards and ordinary cards. It is a small and light-weight machine which is suitable for the production of small card factories and the pre-laminated test of the medium-sized and the large card factories.


技术参数

额定压力:18MPa

电源电压:三相AC380V   50Hz  

压力精度:0.1Mpa

版面尺寸:250mm×350mm

工 位 数:冷热各5层

电热控制:稳定温度±1℃

重    量:1500kg

外型尺寸:1600mm(L)×600(W)×1500mm(H)


l Echnical parameter

  Rated Pressure18Mpa

  Power Voltage3 Phase AC380V 50Hz

  Pressure precision0.1Mpa

  Laminating Area: 420mm*520mm

  Opening: Cold/Hot in 5 tower each

  Electric Heating control +/- 1C

Weight1500kg

Dimension1600mm(L)×600(W)×1500mm(H)