全国统一服务电话: 0471-3604670
产品中心
当前位置: 首页 > 产品中心 > 层合机
CH22*32B层合打样机

-

CH22-32B层合打样机

该机主要用于智能卡及普通卡的层合工艺。该设备体积小、重量轻,适用于小型卡厂的生产及大、中型卡厂的前期层合试验。

CH22-32 Lamination Proofer

l This is for laminating of smart cards and ordinary cards. It is a small and light-weight machine which is suitable for the production of small card factories and the pre-laminated test of the medium-sized and the large card factories.


产品概述和特点 技术参数 相关下载

CH22-32B层合打样机

该机主要用于智能卡及普通卡的层合工艺。该设备体积小、重量轻,适用于小型卡厂的生产及大、中型卡厂的前期层合试验。

CH22-32 Lamination Proofer:

l This is for laminating of smart cards and ordinary cards. It is a small and light-weight machine which is suitable for the production of small card factories and the pre-laminated test of the medium-sized and the large card factories.


技术参数

额定压力:18MPa

电源电压:三相AC380V   50Hz  

总 功 率:≤6kw

版面尺寸:220mm×320mm

工 位 数:冷热各1层

重    量:1000kg

外型尺寸:1300mm(L)×700(W)×1600mm(H)

l Echnical parameter

 Rated Pressure18Mpa

  Power Voltage3 Phase AC380V 50Hz

  Consumption:≤6kw

  Laminating Area: 220mm*320mm

  Opening: Cold/Hot in 1 tower each

Weight1000kg

Dimension1300mm(L)×700(W)×1600mm(H)